Title :
Three-dimensional MMIC architecture using low thermal impedance technology
Author :
Hill, D. ; Tutt, M. ; Yarborough, R. ; Budka, T. ; Tae Kim
Author_Institution :
TriQuint Semicond., Dallas, TX, USA
Abstract :
A novel architecture for monolithic microwave integrated circuits (MMICs) simultaneously provides significant reduction in die area and extremely efficient heat transfer, as evidenced by 2/spl times/2 mm/sup 2/ MMICs which deliver up to 40 W CW at 1.8 GHz.
Keywords :
MMIC; UHF integrated circuits; integrated circuit design; integrated circuit technology; thermal resistance; 3D MMIC architecture; die area reduction; efficient heat transfer; low thermal impedance technology; monolithic microwave integrated circuits; three-dimensional MMIC architecture; Capacitors; Electromagnetic heating; Gallium arsenide; Heat transfer; Impedance; MMICs; Microstrip; Microwave technology; Phased arrays; Power transmission lines;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.705087
