DocumentCode
1868267
Title
Three-dimensional MMIC architecture using low thermal impedance technology
Author
Hill, D. ; Tutt, M. ; Yarborough, R. ; Budka, T. ; Tae Kim
Author_Institution
TriQuint Semicond., Dallas, TX, USA
Volume
2
fYear
1998
fDate
7-12 June 1998
Firstpage
699
Abstract
A novel architecture for monolithic microwave integrated circuits (MMICs) simultaneously provides significant reduction in die area and extremely efficient heat transfer, as evidenced by 2/spl times/2 mm/sup 2/ MMICs which deliver up to 40 W CW at 1.8 GHz.
Keywords
MMIC; UHF integrated circuits; integrated circuit design; integrated circuit technology; thermal resistance; 3D MMIC architecture; die area reduction; efficient heat transfer; low thermal impedance technology; monolithic microwave integrated circuits; three-dimensional MMIC architecture; Capacitors; Electromagnetic heating; Gallium arsenide; Heat transfer; Impedance; MMICs; Microstrip; Microwave technology; Phased arrays; Power transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location
Baltimore, MD, USA
ISSN
0149-645X
Print_ISBN
0-7803-4471-5
Type
conf
DOI
10.1109/MWSYM.1998.705087
Filename
705087
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