SDL(Soft Defect Location) technical in analysing the laser beam wavelength and temperature sensitive failures in VLSI failure analysis

Due to the decreasing metal line size on complicated integrated circuit, non-destructive analysis strategy was very significant to failure analysis, especially met those special failures which were cold or high temperature failure and light sensitive failure. Two real special cases were presented in this paper to show when and how SDL (Soft Defect Location) technical can be considered to find the root cause of cold or high temperature and laser beam sensitive failure efficiently.