Title :
Parallelization of a relaxation method to run on the Intel Paragon
Author :
Lee, C.Y. ; Lee, S.M. ; Oh, J.S. ; Koo, B.H.
Author_Institution :
Supercomput. Appl. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
fDate :
28 Apr-2 May 1997
Abstract :
We present a fast parallelized under-relaxation iterative algorithm applicable in solving a large scale Laplace equation that is incorporated into injection molding analysis. The rate of speed gain versus number of processors is studied using three models with different data sizes. Experimental results of running on 32 Intel Paragon processors show reductions up to 98% of original computation time obtained by using a SGI Challenge. Moreover, due to a better memory utilization, the observed speed gain is greater than the proportional increase in the number of processors used
Keywords :
Laplace equations; computer aided engineering; iterative methods; parallel machines; plastics; relaxation; Intel Paragon processors; computation time; computer aided plastic application; fast parallelized under-relaxation iterative algorithm; injection molding analysis; large scale Laplace equation; memory utilization; relaxation method parallelization; speed gain; Cities and towns; Cooling; Heat transfer; Injection molding; Laplace equations; Plastics; Relaxation methods; Supercomputers; Temperature; Thermal conductivity;
Conference_Titel :
High Performance Computing on the Information Superhighway, 1997. HPC Asia '97
Conference_Location :
Seoul
Print_ISBN :
0-8186-7901-8
DOI :
10.1109/HPC.1997.592213
