• DocumentCode
    1868769
  • Title

    OBIRCH analysis of electrostatic discharge ICs

  • Author

    Xuanlong Chen ; Qingsa Li ; Liyuan Liu ; Bing Liu

  • Author_Institution
    China Electron. Product Reliability & Environ. Testing Inst., Guangzhou, China
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    271
  • Lastpage
    274
  • Abstract
    ESD sensitive test was performed to verify the design of circuit protection unit. The failure ICs were analyzed by OBIRCH technique. Three anomalous thermally sensitive sites were localized including I/O and VCCIOs. OBIRCH analysis confirmed the failure sites were directly connect to the pads, mostly ESD protection units, decoupling capacitor and internal inverter. Physical failure analysis confirmed the OBIRCH findings, and revealed that improper triggering of ggNMOS structure and gate oxide breakdown were the root causes, the effectiveness and robustness of the structure need improvement. The suspect was also verified against failure data measured using TLP testing. All these experimental investigations were carried out in order to develop optimized protection structures against ESD.
  • Keywords
    electrostatic discharge; failure analysis; integrated circuit testing; ESD protection units; ESD sensitive test; OBIRCH analysis; TLP testing; VCCIO; anomalous thermally sensitive sites; circuit protection unit; decoupling capacitor; electrostatic discharge IC; failure IC; failure data; failure sites; gate oxide breakdown; ggNMOS structure; internal inverter; optimized protection structures; physical failure analysis; Capacitors; Electrostatic discharges; Failure analysis; Inverters; Logic gates; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224395
  • Filename
    7224395