DocumentCode
1869102
Title
Highly reliable MEMS relay with two-step spring system and heat sink insulator for power applications
Author
Yong-Hoon Yoon ; Yong-Ha Song ; Seung-Deok Ko ; Chang-Hoon Han ; Geon-Sik Yun ; Min-Ho Seo ; Jun-Bo Yoon
Author_Institution
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
fYear
2015
fDate
18-22 Jan. 2015
Firstpage
114
Lastpage
117
Abstract
This paper reports remarkably reliable MEMS relays having a unique two-step spring system and a heat sink insulator. The two-step spring system is designed to reduce Joule-heating by lowering contact resistance. The heat sink insulator is proposed for efficiently removing heat generated in the contact area. These two features are firstly adopted in the MEMS relay for minimizing thermal damage in high current level, thus enhancing reliability significantly. The fabricated relay demonstrated contact resistance of 2 mΩ, which is the lowest value compared to the state-of-the-art [11]. In addition, the relay was operated up to 5.3×106 cycles at 1 V/200 mA in an air and hot switching condition with negligible contact resistance variation. The resulting lifetime is 500 times longer than that of the commercial MEMS relay measured in the same test setup.
Keywords
contact resistance; heat sinks; insulators; microrelays; reliability; Joule-heating design; air switching condition; contact area; contact resistance; current 200 mA; heat sink insulator; high current level; highly reliable MEMS relay; hot switching condition; reliability; resistance 2 mohm; thermal damage minimization; two-step spring system; voltage 1 V; Contact resistance; Heat sinks; Insulators; Micromechanical devices; Relays; Reliability; Springs;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
Conference_Location
Estoril
Type
conf
DOI
10.1109/MEMSYS.2015.7050899
Filename
7050899
Link To Document