• DocumentCode
    1869985
  • Title

    Semiconductor ic packaging, the next wave

  • Author

    Hung, C.P.

  • Author_Institution
    Corp. R&D, Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
  • fYear
    2015
  • fDate
    18-22 Jan. 2015
  • Firstpage
    234
  • Lastpage
    234
  • Abstract
    MEMS sensor growth in the future is expected with inevitable trend on miniaturization for smartphone and wearable devices. In this presentation, the next wave architecture of 3D IC packaging solution overview versus traditional packaging technologies will be demonstrated and discussed, for applications including MEMS.
  • Keywords
    integrated circuit packaging; microsensors; 3D IC packaging; MEMS sensor; next wave architecture; semiconductor IC packaging; smart phone; wearable devices; Accelerometers; Integrated circuit packaging; Market research; Micromechanical devices; Three-dimensional displays; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
  • Conference_Location
    Estoril
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2015.7050930
  • Filename
    7050930
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1869985