Title :
Semiconductor ic packaging, the next wave
Author_Institution :
Corp. R&D, Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
Abstract :
MEMS sensor growth in the future is expected with inevitable trend on miniaturization for smartphone and wearable devices. In this presentation, the next wave architecture of 3D IC packaging solution overview versus traditional packaging technologies will be demonstrated and discussed, for applications including MEMS.
Keywords :
integrated circuit packaging; microsensors; 3D IC packaging; MEMS sensor; next wave architecture; semiconductor IC packaging; smart phone; wearable devices; Accelerometers; Integrated circuit packaging; Market research; Micromechanical devices; Three-dimensional displays; Through-silicon vias;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
Conference_Location :
Estoril
DOI :
10.1109/MEMSYS.2015.7050930
