Title :
M3d: a multidimensional dynamic configurable router
Author :
Lau, Kei May ; Szygenda, S.A.
Keywords :
Chip scale packaging; Costs; Multidimensional systems; Nonhomogeneous media; Pins; Power generation; Routing; Systems engineering and theory; Testing; Very large scale integration;
Conference_Titel :
Circuits and Systems, 1993., ISCAS '93, 1993 IEEE International Symposium on
Conference_Location :
IEEE
Print_ISBN :
0-7803-1281-3