Title :
Reliability assurance of application-specific microelectronic circuits
Author :
Sheu, Bing J. ; Hsu, Wen-jay ; Tyree, Vance
Author_Institution :
Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
Abstract :
An integrated-circuit reliability simulator has been developed. Model parameters for the reliability simulation are obtained through accelerated tests on specially designed test structures. The design of several test chips and associated experimental results are presented. Reliability simulations are described at the detailed circuit-design level using the SPICE circuit simulator or its derivatives as the key module. A computer-automated characterization system is necessary to extract parameter values for the new degradation models
Keywords :
application specific integrated circuits; circuit analysis computing; digital simulation; reliability; software packages; ASIC; SPICE; accelerated tests; application-specific microelectronic circuits; circuit analysis; degradation models; design; reliability simulator; software packages; CMOS technology; Circuit simulation; Circuit testing; Electromigration; Electrons; Hot carrier effects; Integrated circuit reliability; Integrated circuit technology; Microelectronics; Very large scale integration;
Conference_Titel :
Reliability and Maintainability Symposium, 1990. Proceedings., Annual
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ARMS.1990.67988
