Reliability assurance of application-specific microelectronic circuits

Author

Sheu, Bing J. ; Hsu, Wen-jay ; Tyree, Vance

Author_Institution

Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA

fYear

1990

fDate

23-25 Jan 1990

Firstpage

381

Lastpage

388

Abstract

An integrated-circuit reliability simulator has been developed. Model parameters for the reliability simulation are obtained through accelerated tests on specially designed test structures. The design of several test chips and associated experimental results are presented. Reliability simulations are described at the detailed circuit-design level using the SPICE circuit simulator or its derivatives as the key module. A computer-automated characterization system is necessary to extract parameter values for the new degradation models

Keywords

application specific integrated circuits; circuit analysis computing; digital simulation; reliability; software packages; ASIC; SPICE; accelerated tests; application-specific microelectronic circuits; circuit analysis; degradation models; design; reliability simulator; software packages; CMOS technology; Circuit simulation; Circuit testing; Electromigration; Electrons; Hot carrier effects; Integrated circuit reliability; Integrated circuit technology; Microelectronics; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability and Maintainability Symposium, 1990. Proceedings., Annual

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ARMS.1990.67988

Filename

67988