• DocumentCode
    1870544
  • Title

    Magnetic Current Imaging using multi path analysis for power short localization

  • Author

    Gaudestad, Jan ; Orozco, Antonio ; Matthews, John ; Po Chih Huang ; Chen, Yen-Hao Jack

  • Author_Institution
    Neocera LLC, Beltsville, MD, USA
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    556
  • Lastpage
    559
  • Abstract
    Magnetic Current Imaging (MCI), a sub technique of Magnetic Field Imaging (MFI), has been used for more than a decade to localize shorts at the package as well as die and wafer level in a non-destructive way. One particular hard category of shorts to localize is a short between power and ground; the so called power shorts. We show in this paper that MCI can localize power shorts in a simple way by using a multi current path strategy through multiple scans by connecting different power and ground connections and using magnetic phase image analysis for sharper signal localization.
  • Keywords
    fault location; imaging; integrated circuit packaging; integrated circuit testing; magnetic field measurement; nondestructive testing; magnetic current imaging; magnetic field imaging; multicurrent path strategy; multipath analysis; power short localization; power shorts localization; wafer level packaging; Magnetic fields; Magnetic resonance imaging; Optical imaging; Optical sensors; SQUIDs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224457
  • Filename
    7224457