Title :
An initiative to develop a new approach for fracture characterization of silicon die crack
Author :
Lin, P. ; Xue, M. ; Chai, C.M. ; Zhang, H.S. ; Xu, H. ; Zhou, K.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ. of Singapore, Singapore, Singapore
fDate :
June 29 2015-July 2 2015
Abstract :
A new approach for fracture characterization of a particular case study on silicon die crack is presented. It consists of four phases - visual inspection, molecular dynamics, finite element method and experiment. This work aims to use these techniques to investigate and provide a theoretical explanation and analysis of the physical failure modes and mechanisms involved, from the molecular to package level.
Keywords :
cracks; electronics packaging; elemental semiconductors; failure analysis; finite element analysis; fracture; inspection; molecular dynamics method; silicon; Si; finite element method; fracture characterization; molecular dynamics; package level; physical failure modes; silicon die crack; visual inspection; Inspection; Integrated circuits; Load modeling; Loading; Silicon; Stress; Visualization;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224458
