Title :
Active Electrostatic Force Microscopy
Author :
Ippolito, Stephen ; Zumwalt, Sean ; Erickson, Andy
Author_Institution :
Multiprobe Inc., Santa Barbara, CA, USA
fDate :
June 29 2015-July 2 2015
Abstract :
We present Active Electrostatic Force Microscopy, as a new integrated circuit analysis technique for tracing nets and localizing opens. We demonstrate non-destructive surface and subsurface potential mapping, similar to Electron Beam Absorbed Current microscopy, without the associated high energy electron beam damage to the dielectrics.
Keywords :
atomic force microscopy; integrated circuit testing; nondestructive testing; active electrostatic force microscopy; dielectrics; electron beam absorbed current microscopy; high energy electron beam damage; integrated circuit analysis technique; nondestructive surface potential mapping; subsurface potential mapping;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224460
