Title :
3D morphology reconstruction of high aspect ratio MEMS structure by using autofluorescence of Parylene C
Author :
Lingqian Zhang ; Yaoping Liu ; Fang Yang ; Wei Wang ; Dacheng Zhang ; Zhihong Li
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
This paper reported a MEMS fabrication compatible, damage free method for in-process 3D morphology reconstruction of high aspect ratio microstructure. As a novel morphology tracer, Parylene C thin film was conformally deposited onto the structure and annealed at high temperature under N2. The autofluorescence of Parylene C was considerably enhanced by the annealing, which made it possible to image the microstructure. By scanning with a confocal microscopy, 3D morphology of the microstructure was reconstructed. The preliminary result indicated that microstructure with width of 8 μm and depth of 34 μm (34.1 μm actual depth by SEM) was successfully and accurately measured by this method.
Keywords :
annealing; micromechanical devices; scanning electron microscopy; thin film devices; three-dimensional integrated circuits; MEMS fabrication compatible; SEM; autofluorescence; confocal microscopy; damage free method; high aspect ratio MEMS microstructure; high temperature annealing; in-process 3D morphology tracer reconstruction; parylene C thin film; scanning electron microscopy; Annealing; Fabrication; Fluorescence; Image reconstruction; Microstructure; Morphology; Three-dimensional displays;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
Conference_Location :
Estoril
DOI :
10.1109/MEMSYS.2015.7050963