• DocumentCode
    1870898
  • Title

    3D morphology reconstruction of high aspect ratio MEMS structure by using autofluorescence of Parylene C

  • Author

    Lingqian Zhang ; Yaoping Liu ; Fang Yang ; Wei Wang ; Dacheng Zhang ; Zhihong Li

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2015
  • fDate
    18-22 Jan. 2015
  • Firstpage
    358
  • Lastpage
    360
  • Abstract
    This paper reported a MEMS fabrication compatible, damage free method for in-process 3D morphology reconstruction of high aspect ratio microstructure. As a novel morphology tracer, Parylene C thin film was conformally deposited onto the structure and annealed at high temperature under N2. The autofluorescence of Parylene C was considerably enhanced by the annealing, which made it possible to image the microstructure. By scanning with a confocal microscopy, 3D morphology of the microstructure was reconstructed. The preliminary result indicated that microstructure with width of 8 μm and depth of 34 μm (34.1 μm actual depth by SEM) was successfully and accurately measured by this method.
  • Keywords
    annealing; micromechanical devices; scanning electron microscopy; thin film devices; three-dimensional integrated circuits; MEMS fabrication compatible; SEM; autofluorescence; confocal microscopy; damage free method; high aspect ratio MEMS microstructure; high temperature annealing; in-process 3D morphology tracer reconstruction; parylene C thin film; scanning electron microscopy; Annealing; Fabrication; Fluorescence; Image reconstruction; Microstructure; Morphology; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
  • Conference_Location
    Estoril
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2015.7050963
  • Filename
    7050963