Title :
Bonding mechanism in the Velcro concept Si-Si low temperature direct bonding technique
Author :
Keshavarzi, Shervin ; Mescheder, Ulrich ; Reinecke, Holger
Author_Institution :
Inst. of Appl. Res. (IAF), Furtwangen Univ.Furtwangen, Furtwangen, Germany
Abstract :
This work presents a bonding mechanism between needle-like surfaces for room temperature Si-Si direct bonding similar to the Velcro-principle, a fully CMOS compatible approach suitable for system integration using Si-motherboard concept. The proposed bonding model is superior to other presented models since it considers humidity effect and the deformation mechanism of the needles during the bonding.
Keywords :
CMOS integrated circuits; elemental semiconductors; integrated circuit bonding; low-temperature techniques; silicon; Si-Si; Si-motherboard concept; Velcro concept Si-Si low temperature direct bonding technique; bonding mechanism; deformation mechanism; fully CMOS compatible approach; humidity effect; needle-like surfaces; room temperature Si-Si direct bonding; temperature 293 K to 298 K; Bonding; Force; Needles; Silicon; Substrates; Surface morphology; Temperature measurement;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
Conference_Location :
Estoril
DOI :
10.1109/MEMSYS.2015.7050977
