Single-pulse and pulse-train effects in ultrafast-laser micromachining of fused silica

Author

Chen, R.P. ; Oettl, A. ; Herman, P.R. ; Marjoribanks, R.S.

Author_Institution

Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

fYear

1999

fDate

28-28 May 1999

Firstpage

357

Lastpage

358

Abstract

Summary form only given. In this paper, we examine etch rates and surface morphology in ultrafast-laser micromachining of /spl sim/1 /spl mu/m diameter holes in fused silica. Shock-induced microcracking was a fundamental limitation of single pulse etching, but could be entirely avoided when mode-locked pulse trains were applied to rapidly micromachined surfaces (at /spl sim/20 /spl mu/m/pulse train).

Keywords

high-speed optical techniques; laser beam etching; laser beam machining; microcracks; micromachining; optical glass; silicon compounds; surface structure; 1 mum; SiO/sub 2/; etch rates; fused SiO/sub 2/; mode-locked pulse trains; pulse-train effects; rapidly surface micromachining; shock-induced microcracking; single pulse etching; single-pulse effects; surface morphology; ultrafast-laser micromachining; Etching; Laser mode locking; Micromachining; Optical materials; Optical microscopy; Optical pulses; Pulse amplifiers; Silicon compounds; Surface cracks; Surface morphology;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 1999. CLEO '99. Summaries of Papers Presented at the Conference on

Conference_Location

Baltimore, MD, USA

Print_ISBN

1-55752-595-1

Type

conf

DOI

10.1109/CLEO.1999.834300

Filename

834300