DocumentCode :
1871439
Title :
Substitution of silver electrode with an abundant metal — A fundamental study
Author :
Tao, M.
Author_Institution :
Dept. of Electr. Eng., Univ. of Texas at Arlington, Arlington, TX, USA
fYear :
2011
fDate :
19-24 June 2011
Abstract :
One of the fundamental bottlenecks for crystalline-Si solar cells to reach a terawatt scale is the scarcity of silver, which is used as the front finger electrode in most commercial Si solar cells today. In this paper, we examine some of the challenges related to low work-function abundant metals, such as aluminum and titanium, as a potential substitution for silver. These challenges include material resistivity, resistance to oxidation, contact resistance and alloying with Si. Valence-mending passivation is proposed as a potential solution to some of the most fundamental challenges including low Schottky barrier to n-type Si for low contact resistance and suppression of aluminum alloying with Si to prevent unintentional p-type doping into n-type Si. Preliminary results are presented on Al and Ti contacts to valence-mended Si(100) surface. Valence-mending passivation allows record-low Schottky barriers of less than 0.1 eV on n-type Si with aluminum and titanium, leading to a 29× reduction in specific contact resistance between titanium and lightly-doped n-type Si. It also suppresses silicidation on Si(100) surface up to ~400°C with titanium as well as nickel.
Keywords :
alloying; chemical exchanges; contact resistance; electrical resistivity; electrodes; elemental semiconductors; oxidation; passivation; silicon; silver; solar cells; alloying; contact resistance; crystalline-Si solar cells; low Schottky barrier; low work-function abundant metals; material resistivity; resistance to oxidation; silver electrode; substitution; valence-mending passivation; Aluminum; Contact resistance; Passivation; Silicon; Silver; Titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
ISSN :
0160-8371
Print_ISBN :
978-1-4244-9966-3
Type :
conf
DOI :
10.1109/PVSC.2011.6186564
Filename :
6186564
Link To Document :
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