• DocumentCode
    1871640
  • Title

    Innovative passivation for reducing degradation of a-Si/uc-Si tandem photovaltaic module

  • Author

    Chang, Chih-Wei ; Wu, Ching-In ; Chuang, Kai-Hsiang ; Chang, Chih-Hsiung ; Lin, Kun-Chih ; Tsai, Chin-Yao

  • Author_Institution
    AURIA SOLAR, Tainan, Taiwan
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    The innovative passivation treatment has been developed for increasing the stabilized power of standard a-Si/μc-Si tandem module and building-integrated photovoltaic (BIPV) via well passivation of μc-Si material. By adopting external passivation technique, the open-circuit voltage (Voc) almost keeps in constant, furthermore, a significant improvement of Voc (~3%) and fill factor (~5%) could be obtained as comparing to reference ones. In the present work, a well passivation treatment for microcrystalline Si to prevent the post-oxidation of the cracks has been reported. About 9 % of improvement of degradation behavior and an outstanding performance of BIPV (93%) could be observed by this unique technique.
  • Keywords
    elemental semiconductors; passivation; silicon; solar cells; surface cracks; BIPV; Si-Si; building-integrated photovoltaic; cracks post-oxidation; fill factor; innovative passivation treatment; microcrystalline; open-circuit voltage; power stability; tandem photovaltaic module degradation reduction; Degradation; IEC standards; Lighting; Passivation; Photovoltaic cells; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186573
  • Filename
    6186573