DocumentCode :
1871640
Title :
Innovative passivation for reducing degradation of a-Si/uc-Si tandem photovaltaic module
Author :
Chang, Chih-Wei ; Wu, Ching-In ; Chuang, Kai-Hsiang ; Chang, Chih-Hsiung ; Lin, Kun-Chih ; Tsai, Chin-Yao
Author_Institution :
AURIA SOLAR, Tainan, Taiwan
fYear :
2011
fDate :
19-24 June 2011
Abstract :
The innovative passivation treatment has been developed for increasing the stabilized power of standard a-Si/μc-Si tandem module and building-integrated photovoltaic (BIPV) via well passivation of μc-Si material. By adopting external passivation technique, the open-circuit voltage (Voc) almost keeps in constant, furthermore, a significant improvement of Voc (~3%) and fill factor (~5%) could be obtained as comparing to reference ones. In the present work, a well passivation treatment for microcrystalline Si to prevent the post-oxidation of the cracks has been reported. About 9 % of improvement of degradation behavior and an outstanding performance of BIPV (93%) could be observed by this unique technique.
Keywords :
elemental semiconductors; passivation; silicon; solar cells; surface cracks; BIPV; Si-Si; building-integrated photovoltaic; cracks post-oxidation; fill factor; innovative passivation treatment; microcrystalline; open-circuit voltage; power stability; tandem photovaltaic module degradation reduction; Degradation; IEC standards; Lighting; Passivation; Photovoltaic cells; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
ISSN :
0160-8371
Print_ISBN :
978-1-4244-9966-3
Type :
conf
DOI :
10.1109/PVSC.2011.6186573
Filename :
6186573
Link To Document :
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