• DocumentCode
    1872146
  • Title

    Deposition temperature effect on a-Si:H produced by DC magnetron sputtering

  • Author

    Santana, R.J. ; Moura, Thiago D. O. ; Guimaraes, G.R. ; Miranda, D.O. ; Proenca, R.T. ; Diniz, A.S.C. ; Branco, J.R.T.

  • Author_Institution
    CETEC, Belo Horizonte, Brazil
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    The use of hydrogenated amorphous silicon, a-Si:H, for improving heterojunction solar cell efficiency and decreasing cost has found increasing interest in recent years. Hydrogen incorporation in thin films of amorphous silicon is crucial for obtaining high quality semiconductor because it passivates Si dangling bonds in the structure. In the present work the effect of deposition temperature in the hydrogen incorporation in a-Si:H films growth by DC magnetron sputtering in Ar-H plasma was studied. The films were deposited over glass and Silicon wafer substrates, and characterized by Raman, FTIR and UV-Vis techniques. The results showed that deposition temperature of 200°C gave an amorphous film with the highest level of hydrogenation about of 28%. The relatively high band gap, between 1,70 and 1.9 eV, is consistent with the significant presence of hydrogen in the amorphous silicon film.
  • Keywords
    Fourier transform spectra; argon compounds; glass; silicon compounds; solar cells; sputter deposition; thin films; ultraviolet spectra; visible spectra; Ar-H; Ar-H plasma; DC magnetron sputtering; FTIR technique; Raman technique; Si:H; UV-Vis technique; amorphous silicon film; deposition temperature effect; glass; heterojunction solar cell efficiency; hydrogen incorporation; hydrogenated amorphous silicon; passivates silicon dangling bond; silicon wafer substrate; temperature 200 C; thin film; Amorphous magnetic materials; Amorphous silicon; Films; Photonic band gap; Photovoltaic cells; Sputtering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186593
  • Filename
    6186593