DocumentCode :
1872348
Title :
65nm CMOS BULK to SOI comparison
Author :
Pelloie, J.L. ; Laplanche, Y. ; Chen, T.F. ; Huang, Y.T. ; Liu, P.W. ; Chiang, W.T. ; Huang, M.Y.T. ; Tsai, C.H. ; Cheng, Y.C. ; Tsai, C.T. ; Ma, G.H.
Author_Institution :
ARM, Grenoble
fYear :
2007
fDate :
1-4 Oct. 2007
Firstpage :
79
Lastpage :
80
Abstract :
SOI is today mainly used for high-speed CPU applications. The advantages brought by SOI are still questioned or not clearly understood and little information has been published about the comparison between bulk and SOI CMOS. First reason is that this comparison to be representative must be done for same process features such as gate length and gate oxide thickness, second reason is that designing the same circuit in both bulk and SOI requires a significant investment. 65nm CMOS bulk and SOI both developed at UMC 12" facility with same process features are compared in this paper.
Keywords :
CMOS integrated circuits; nanoelectronics; silicon-on-insulator; CMOS bulk devices; SOI; gate length; gate oxide thickness; silicon-on-insulator; size 65 nm; CMOS logic circuits; Circuit simulation; Circuit synthesis; Delay; Frequency; Implants; Integrated circuit interconnections; Semiconductor films; Silicon; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2007 IEEE International
Conference_Location :
Indian Wells, CA
ISSN :
1078-621X
Print_ISBN :
978-1-4244-0879-5
Electronic_ISBN :
1078-621X
Type :
conf
DOI :
10.1109/SOI.2007.4357861
Filename :
4357861
Link To Document :
بازگشت