• DocumentCode
    1872348
  • Title

    65nm CMOS BULK to SOI comparison

  • Author

    Pelloie, J.L. ; Laplanche, Y. ; Chen, T.F. ; Huang, Y.T. ; Liu, P.W. ; Chiang, W.T. ; Huang, M.Y.T. ; Tsai, C.H. ; Cheng, Y.C. ; Tsai, C.T. ; Ma, G.H.

  • Author_Institution
    ARM, Grenoble
  • fYear
    2007
  • fDate
    1-4 Oct. 2007
  • Firstpage
    79
  • Lastpage
    80
  • Abstract
    SOI is today mainly used for high-speed CPU applications. The advantages brought by SOI are still questioned or not clearly understood and little information has been published about the comparison between bulk and SOI CMOS. First reason is that this comparison to be representative must be done for same process features such as gate length and gate oxide thickness, second reason is that designing the same circuit in both bulk and SOI requires a significant investment. 65nm CMOS bulk and SOI both developed at UMC 12" facility with same process features are compared in this paper.
  • Keywords
    CMOS integrated circuits; nanoelectronics; silicon-on-insulator; CMOS bulk devices; SOI; gate length; gate oxide thickness; silicon-on-insulator; size 65 nm; CMOS logic circuits; Circuit simulation; Circuit synthesis; Delay; Frequency; Implants; Integrated circuit interconnections; Semiconductor films; Silicon; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2007 IEEE International
  • Conference_Location
    Indian Wells, CA
  • ISSN
    1078-621X
  • Print_ISBN
    978-1-4244-0879-5
  • Electronic_ISBN
    1078-621X
  • Type

    conf

  • DOI
    10.1109/SOI.2007.4357861
  • Filename
    4357861