Evaluation of embedded heat extraction for high power density integrated electromagnetic power passives

Author

Dirker, J. ; Liu, W. ; van Wyk, J.D. ; Meyer, J.P.

Author_Institution

Dept. of Mech. Eng., Rand Afrikaans Univ., South Africa

Volume

6

fYear

2004

fDate

20-25 June 2004

Firstpage

4888

Abstract

The use of embedded solid-state heat extractors to increase the power densities in power electronic modules seems promising. Cross-sectional geometric optimisation was done on heat extraction insert and it was found that the most suitable heat extraction configuration for application in power electronics is the use of flat continuous heat extraction layers aiding in conducting heat to externally mounted heat sinks. Theoretic expected thermal enhancement factors were determined and experimentally verified. Interfacial thermal resistances adversely influence the effectiveness of heat extraction inserts and should be minimised.

Keywords

heat sinks; optimisation; power electronics; cross-sectional geometric optimisation; embedded heat extraction; embedded solid-state heat extractor; heat sink; integrated electromagnetic power passive; interfacial thermal resistance; power electronic module; thermal enhancement factor; Africa; Conducting materials; Electromagnetic heating; Heat sinks; Magnetic materials; Power electronics; Resistance heating; Solid state circuits; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual

ISSN

0275-9306

Print_ISBN

0-7803-8399-0

Type

conf

DOI

10.1109/PESC.2004.1354864

Filename

1354864