Title :
Some factors that affect performance of capillary flip chip underfills
Author_Institution :
Dexter Electron. Mater., CA, USA
Abstract :
Not all capillary flip chip underfill materials are created equal. Differences that affect performance that frequently do not appear on product information sheets will be discussed. Data such as adhesion to different surfaces and flow rates will be compared for various underfill formulations. Some process variables will also be discussed
Keywords :
adhesion; capillarity; encapsulation; flip-chip devices; integrated circuit packaging; viscosity; adhesion; capillary flip chip underfills; flow rates; process variables; underfill formulations; Adhesives; Electronics industry; Flip chip; Industrial electronics; Material properties; Packaging; Passivation; Sheet materials; Testing; Viscosity;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664428
