• DocumentCode
    1873199
  • Title

    Design and fabrication of field emission-based pressure microsensors

  • Author

    Badi, N. ; He, K. ; Nair, A. ; Bensaoula, A.

  • Author_Institution
    Dept. of Phys., Houston Univ., TX, USA
  • fYear
    2004
  • fDate
    11-16 July 2004
  • Firstpage
    24
  • Lastpage
    25
  • Abstract
    The development of functional field emission based pressure microsensors is reported. The fabrication and development of both electrical and mechanical parts of the pressure sensor device are investigated; these are the cold cathode emitters and the sensing membranes, respectively. In order to avoid expensive process runs and optimize the design to meet the sensor requirements, simulation work was performed using commercially available FEMLAB package software. Realistic field emission characteristics from sulfur doped boron nitride (S-BN) cold cathode were used to model the current density distribution in the deflected diaphragm. The total current output was achieved by integrating the current density over the entire area of the membrane as a function of the external pressure.
  • Keywords
    boron compounds; cathodes; current density; field emission; microsensors; pressure sensors; silicon; tantalum; titanium; titanium compounds; BN:S; FEMLAB package software; Si; Ta; Ti; TiN; cold cathode emitters; current density distribution modelling; deflected diaphragm; electrical parts; field emission characteristics; field emission-based pressure microsensors; mechanical parts; microsensor design; microsensor fabrication; sensing membranes; sensor requirements; sulfur doped boron nitride cold cathode; total current output; Biomembranes; Cathodes; Current density; Design optimization; Fabrication; Mechanical sensors; Microsensors; Packaging; Sensor phenomena and characterization; Software packages;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference, 2004. IVNC 2004. Technical Digest of the 17th International
  • Print_ISBN
    0-7803-8397-4
  • Type

    conf

  • DOI
    10.1109/IVNC.2004.1354880
  • Filename
    1354880