Title :
Electromagnetic induction heating for cold wall rapid thermal processing
Author :
Thompson, K. ; Booske, J.H. ; Gianchandani, Y. ; Cooper, R. ; Bykov, Yu. ; Eremeev, A. ; Plotnikov, I.
Author_Institution :
Wisconsin Univ., Madison, WI, USA
Abstract :
Electromagnetic Induction Heating is a novel heating technique by which shallow implanted dopants can be activated with minimal movement of the as implanted profile. Silicon wafers can be directly heated, without the use of a susceptor, in the RF (13.56 MHz), microwave (2.45 GHz), or millimeter wave (30.5 GHz) regimes. Heating rates of at least 125°C/sec have been achieved and are shown along with temperature vs. power plots in the different frequency ranges. SIMS profiles of as implanted and EMIH annealed boron implants show that considerable activation can be achieved with no diffusion of the junction depth. Post-anneal junctions with sheet resistances that meet the 100 nm technology node and that, with optimization, may meet the 70 nm technology node have been realized. It is suspected that the high frequency electric fields present during annealing provide an additional driving force toward dopant activation, allowing for higher activation at lower temperatures.
Keywords :
doping profiles; induction heating; ion implantation; microwave heating; radiofrequency heating; rapid thermal annealing; secondary ion mass spectra; 100 nm; 100 nm technology node; 13.56 MHz; 2.45 GHz; 30.5 GHz; 70 nm technology node; RF regime; SIMS profiles; Si:B; annealing; cold wall rapid thermal processing; electromagnetic induction heating; heating rates; high frequency electric fields; microwave regime; millimeter wave regime; post-anneal junctions; shallow implanted dopant activation; sheet resistances; silicon wafers; temperature power plots; Annealing; Boron; Electromagnetic heating; Electromagnetic induction; Implants; Millimeter wave technology; Radio frequency; Rapid thermal processing; Silicon; Temperature;
Conference_Titel :
Advanced Thermal Processing of Semiconductors 9th Internationa Conference on RTP 2001
Print_ISBN :
0-9638251-0-4
DOI :
10.1109/RTP.2001.1013765