• DocumentCode
    1873534
  • Title

    Modeling thermal fatigue in CPV cell assemblies

  • Author

    Bosco, Nick ; Panchagade, Dhananjay ; Kurtz, Sarah

  • Author_Institution
    Nat. Renewable Energy Lab., Golden, CO, USA
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    Summary form only give. @font-face {font-family: "Arial";}p.MsoNormal, li.MsoNormal, div. MsoNormal {margin: 0in 0in 0.0001pt; font-size: 12pt; font-family: "Times New Roman";}div. Section1 {page: Section1;}. A finite element model has been created to quantify the thermal fatigue damage of the CPV die attach. Simulations are used to compare to results of empirical thermal fatigue equations originally developed for accelerated chamber cycling. While the empirical equations show promise when extrapolated to the lower temperature cycles characterisitic of weather-induced temperature changes in the CPV die attach, it is demonstrated that their damage does not accumulate linearly: the damage a particular cycle contributes depends on the preceding cycles. Simulations of modeled CPV cell temperature histories provided for direct comparison of the FEM and empirical methods, and for calculation of equivalent times provided by standard accelerated test sequences.
  • Keywords
    finite element analysis; life testing; microassembling; solar cells; solar energy concentrators; thermal stress cracking; CPV cell assembly; CPV cell temperature modelling; CPV die attach; FEM; accelerated chamber cycling; accelerated test sequences; concentrator photovoltaic cells; empirical thermal fatigue equations; finite element model; temperature cycles characterisitic; thermal fatigue modelling; weather-induced temperature; Equations; Fatigue; Finite element methods; IEEE Xplore; Mathematical model; Microassembly; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186652
  • Filename
    6186652