DocumentCode :
1873534
Title :
Modeling thermal fatigue in CPV cell assemblies
Author :
Bosco, Nick ; Panchagade, Dhananjay ; Kurtz, Sarah
Author_Institution :
Nat. Renewable Energy Lab., Golden, CO, USA
fYear :
2011
fDate :
19-24 June 2011
Abstract :
Summary form only give. @font-face {font-family: "Arial";}p.MsoNormal, li.MsoNormal, div. MsoNormal {margin: 0in 0in 0.0001pt; font-size: 12pt; font-family: "Times New Roman";}div. Section1 {page: Section1;}. A finite element model has been created to quantify the thermal fatigue damage of the CPV die attach. Simulations are used to compare to results of empirical thermal fatigue equations originally developed for accelerated chamber cycling. While the empirical equations show promise when extrapolated to the lower temperature cycles characterisitic of weather-induced temperature changes in the CPV die attach, it is demonstrated that their damage does not accumulate linearly: the damage a particular cycle contributes depends on the preceding cycles. Simulations of modeled CPV cell temperature histories provided for direct comparison of the FEM and empirical methods, and for calculation of equivalent times provided by standard accelerated test sequences.
Keywords :
finite element analysis; life testing; microassembling; solar cells; solar energy concentrators; thermal stress cracking; CPV cell assembly; CPV cell temperature modelling; CPV die attach; FEM; accelerated chamber cycling; accelerated test sequences; concentrator photovoltaic cells; empirical thermal fatigue equations; finite element model; temperature cycles characterisitic; thermal fatigue modelling; weather-induced temperature; Equations; Fatigue; Finite element methods; IEEE Xplore; Mathematical model; Microassembly; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
ISSN :
0160-8371
Print_ISBN :
978-1-4244-9966-3
Type :
conf
DOI :
10.1109/PVSC.2011.6186652
Filename :
6186652
Link To Document :
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