Title :
18 kW three phase inverter system using hermetically sealed SiC phase-leg power modules
Author :
Zhang, Hui ; Tolbert, Leon M. ; Han, Jung Hee ; Chinthavali, Madhu S. ; Barlow, Fred
Author_Institution :
Electr. Eng. Dept., Tuskegee Univ., Tuskegee, AL, USA
Abstract :
Power electronics play an important role in electricity utilization from generation to end customers. Thus, high-efficiency power electronics help to save energy and conserve energy resources. Research on silicon carbide (SiC) power electronics has shown their better efficiency compared to Si power electronics due to the significant reduction in both conduction and switching losses. Combined with their high-temperature capability, SiC power electronics are more reliable and compact. This paper focuses on the development of such a high efficiency, high temperature inverter based on SiC JFET and diode modules. It involves the work on high temperature packaging (>200°C), inverter design and prototype development, device characterization, and inverter testing. A SiC inverter prototype with a power rating of 18 kW is developed and demonstrated. When tested at moderate load levels compared to the inverter rating, an efficiency of 98.2% is achieved by the initial prototype without optimization, which is higher than most Si inverters.
Keywords :
hermetic seals; invertors; junction gate field effect transistors; power electronics; silicon compounds; SiC; electricity utilization; hermetically sealed phase-leg power modules; high temperature inverter; high-efficiency power electronics; inverter testing; power inverter rating; silicon carbide JFET; silicon carbide diode modules; three phase inverter system; Energy resources; Hermetic seals; Inverters; Multichip modules; Power electronics; Power generation; Prototypes; Silicon carbide; Temperature; Testing; Efficiency; High temperature; Inverter; Packaging; SiC JFET; Silicon Carbide (SiC);
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2010 Twenty-Fifth Annual IEEE
Conference_Location :
Palm Springs, CA
Print_ISBN :
978-1-4244-4782-4
Electronic_ISBN :
1048-2334
DOI :
10.1109/APEC.2010.5433365