• DocumentCode
    1874255
  • Title

    Assembly processes for thin film CIGS solar cells: Approaches for improving interconnect repeatability and costs

  • Author

    DeGroot, Marty W. ; Mills, Mike ; Ramesh, Narayan ; Sakuma, Minoru ; Clark, Lindsey A. ; Stempki, Matt

  • Author_Institution
    Dow Solar Solutions, Dow Chem. Co., Midland, MI, USA
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    We have developed new assembly equipment for manufacturing interconnected CIGS solar cell strings that delivers improved control of mechanical tolerances and improved form factor flexibility. The assembly approach is based upon the use of pallets that ensure alignment of solar cells and ribbons during the assembly and curing process. An overview of the assembly equipment is provided. Also discussed are the results of an improved multi-wire interconnect technology that provides a 10% reduction in series resistance relative to standard strings with interconnects provided via electrically conductive adhesive.
  • Keywords
    copper compounds; gallium compounds; indium compounds; interconnected systems; semiconductor thin films; solar cells; CuInGaSe2; assembly processes; costs; electrically conductive adhesive; form factor flexibility; interconnect repeatability; mechanical tolerances; ribbons; thin film CIGS solar cells; Assembly; Lamination; Materials; Photovoltaic cells; Resistance; Silver; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186680
  • Filename
    6186680