DocumentCode :
1874255
Title :
Assembly processes for thin film CIGS solar cells: Approaches for improving interconnect repeatability and costs
Author :
DeGroot, Marty W. ; Mills, Mike ; Ramesh, Narayan ; Sakuma, Minoru ; Clark, Lindsey A. ; Stempki, Matt
Author_Institution :
Dow Solar Solutions, Dow Chem. Co., Midland, MI, USA
fYear :
2011
fDate :
19-24 June 2011
Abstract :
We have developed new assembly equipment for manufacturing interconnected CIGS solar cell strings that delivers improved control of mechanical tolerances and improved form factor flexibility. The assembly approach is based upon the use of pallets that ensure alignment of solar cells and ribbons during the assembly and curing process. An overview of the assembly equipment is provided. Also discussed are the results of an improved multi-wire interconnect technology that provides a 10% reduction in series resistance relative to standard strings with interconnects provided via electrically conductive adhesive.
Keywords :
copper compounds; gallium compounds; indium compounds; interconnected systems; semiconductor thin films; solar cells; CuInGaSe2; assembly processes; costs; electrically conductive adhesive; form factor flexibility; interconnect repeatability; mechanical tolerances; ribbons; thin film CIGS solar cells; Assembly; Lamination; Materials; Photovoltaic cells; Resistance; Silver; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
ISSN :
0160-8371
Print_ISBN :
978-1-4244-9966-3
Type :
conf
DOI :
10.1109/PVSC.2011.6186680
Filename :
6186680
Link To Document :
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