DocumentCode :
1874340
Title :
A high-q all-fused silica solid-stem wineglass hemispherical resonator formed using micro blow torching and welding
Author :
Jae Yoong Cho ; Najafi, Khalil
Author_Institution :
Center for Wireless Integrated MicroSensing & Syst. (WIMS2), Univ. of Michigan, Ann Arbor, MI, USA
fYear :
2015
fDate :
18-22 Jan. 2015
Firstpage :
821
Lastpage :
824
Abstract :
We report a new fabrication technology for making fused silica (FS) wineglass resonators with arbitrarily sized FS solid stems through a simultaneous process of micro blow-torching and microwelding. The process allows the welding of multiple FS structures at controlled locations during blow torching. We demonstrate a new micro FS wineglass resonator with high quality factor (Q) and long ring down time (τ). The resonator is formed by blow torching and flowing a thin FS substrate using vacuum to form the resonator shell, and by welding the shell to a solid post at a controlled location. The flowing of the shell and welding to the rod is performed in one step and in a single mold. This solid-stem resonator offers low anchor loss due to the large stem length/stiffness, and small shell rim thickness. The device has a shell radius/height of ~2.8 mm, and a stem radius of 0.5 mm. At <;10 μTorr vacuum, the n=2 wineglass mode, located at a frequency (f) of 22.6 kHz, has σ = 35.9 s and Q = 2.55 million.
Keywords :
Q-factor; blow moulding; microfabrication; micromechanical resonators; shell casting; silicon compounds; welding; SiO2; fabrication technology; frequency 22.6 kHz; high quality factor; high-Q all-fused silica solid-stem wineglass hemispherical resonator; large stem length-stiffness; long ring down time; low anchor loss; microFS wineglass resonator; microblow torching; microwelding; multiple FS structures; resonator shell; single mold; size 0.5 mm; small shell rim thickness; solid-stem resonator; thin FS substrate; time 35.9 s; vacuum; Electric shock; Scanning electron microscopy; Solids; Substrates; Vibrations; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
Conference_Location :
Estoril
Type :
conf
DOI :
10.1109/MEMSYS.2015.7051085
Filename :
7051085
Link To Document :
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