Study of mutual coupling on mobile phone PCB with shielding using FDTD

In this paper, coupling between the active traces and the two 50 Ohm victimports on a real phone PCB model is simulated by using FDTD, and the coupling mechanisms with different configurations of the shielding are studied. The coupling performance of the real phone PCB model is reproduced with numerical simulation. From the observations of the simulation results, two different scenarios are studied in terms of the coupling mechanisms; the PCB without the shielding and with various geometries of the shielding, including different dimensions and different types of perforated shielding. A simplified PCB model based on the real phone model was built to study the coupling mechanisms. Finally, other factors of affecting the coupling and the guidelines for reducing the coupling by shielding design are also discussed.