DocumentCode :
1874496
Title :
Mechanical testing of thin polymer films
Author :
Feger, Claudius
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
1998
fDate :
15-18 Mar 1998
Firstpage :
77
Lastpage :
81
Abstract :
Package designers need reliable mechanical data of packaging materials at a variety of temperatures in order to predict stress distribution and to make long term predictions on package reliability. It is generally assumed that coefficients of thermal expansion and modulus data of metals and ceramics do not depend on the film thickness of these materials. The same, however, does not hold true for polymers. This poses several questions: How strong is the dependence of thermo-mechanical properties on film thickness? How well can these properties be measured? Do all polymers behave similarly? This paper explores some of these issues
Keywords :
elastic moduli measurement; mechanical testing; polymer films; thermal expansion measurement; elastic modulus; mechanical testing; packaging material; polymer thin film; reliability; stress distribution; thermal expansion coefficient; thermomechanical properties; Ceramics; Inorganic materials; Materials reliability; Packaging; Polymer films; Temperature distribution; Testing; Thermal expansion; Thermal stresses; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
Type :
conf
DOI :
10.1109/ISAPM.1998.664438
Filename :
664438
Link To Document :
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