Title :
An LTCC superstrate patch antenna for 60-GHz package applications
Author :
Liu, Duixian ; Chen, HoChung ; Floyd, B.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
In this paper we present an aperture-coupled superstrate patch antenna with an embedded air cavity. This package eliminates the RFIC chip cavity to simplify the manufacturing process. The package presented is based on low-temperature co-fired ceramic (LTCC) technology; however, the package structure can be implemented in a variety of technologies, including PCB/MLO.
Keywords :
ceramic packaging; microstrip antennas; radiofrequency integrated circuits; 60-GHz package applications; LTCC superstrate patch antenna; MLO; PCB; RFIC chip cavity; aperture-coupled superstrate patch antenna; embedded air cavity; low-temperature cofired ceramic technology; manufacturing process; package structure; Antenna feeds; Antenna radiation patterns; Cavity resonators; Reflector antennas;
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2010 IEEE
Conference_Location :
Toronto, ON
Print_ISBN :
978-1-4244-4967-5
DOI :
10.1109/APS.2010.5561139
