Title :
Crosstalk in coupled interconnects with meshed ground planes
Author :
Luo, Sifen ; Jyh-Ming Jang ; Tripathi, Vijai K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
A method for the time domain simulation of coupled interconnects in a layered medium with meshed ground planes is presented. The method, based on the quasi-TEM spectral domain analysis of the layered structure and the SPICE model consisting of delay elements and linear dependent sources, is used to study crosstalk in coupled interconnects. The theoretical results are validated by experimental data, and it is shown that the presence of slots and meshes in ground planes can reduce the far-end crosstalk in coupled interconnects
Keywords :
SPICE; crosstalk; matrix algebra; multichip modules; spectral-domain analysis; time-domain analysis; transmission line theory; MCM; SPICE model; coupled interconnects; delay elements; far-end crosstalk; layered medium; linear dependent sources; meshed ground planes; quasi-TEM spectral domain analysis; slots; time domain simulation; Capacitance; Coupled mode analysis; Crosstalk; Equations; Green´s function methods; Integrated circuit interconnections; Power system interconnection; Power transmission lines; Transmission line matrix methods; Transmission line theory;
Conference_Titel :
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-5560-7
DOI :
10.1109/MCMC.1994.292514
