Title :
A silicon-on-silicon multichip module technology with integrated bipolar components in the substrate
Author :
Day, Ray-Long ; Hruska, Christopher D. ; Tai, King L. ; Frye, Robert C. ; Lau, Maureen Y. ; Sullivan, Paul A.
Author_Institution :
AT&T Bell Labs., Lee´´s Summit, MO, USA
Abstract :
To address the needs of cost driven, mixed signal applications, we have developed a silicon-on-silicon technology that incorporates both passive and active devices in the module substrate. The technology combines a simple, double-diffused epitaxial bipolar technology with our thin-film MCMs. We describe the basic elements of the technology, typical active device properties and some examples of their use in a low-cost MCM
Keywords :
bipolar integrated circuits; elemental semiconductors; mixed analogue-digital integrated circuits; multichip modules; silicon; MCM substrate design; Si-Si; Si-on-Si multichip module technology; active device properties; double-diffused epitaxial bipolar technology; full custom design ASIC; integrated bipolar components; mixed signal applications; passive devices; thin-film MCMs; Assembly; Bipolar integrated circuits; Bipolar transistors; Cities and towns; Costs; Multichip modules; Resistors; Silicon; Substrates; Telephony;
Conference_Titel :
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-5560-7
DOI :
10.1109/MCMC.1994.292525
