Application specific electronic modules (ASEM) CAD/CAE/CAM interface specification alliance

Author

Drake, Kenneth ; Abadir, Magdy ; Stark, Shaune ; Rhyne, Tom ; Eskew, Mark ; Lockwood, Lucius ; Salsburg, Kevyn ; Harr, Randy ; Concha, Louis

Author_Institution

Microelectron. & Comput. Technol. Corp., Austin, TX, USA

fYear

1994

fDate

15-17 Mar 1994

Firstpage

44

Lastpage

49

Abstract

This paper introduces a new industry alliance of ASEM merchant foundries, customers, EDA vendors, and suppliers. The objective of this Alliance is to establish an interface specification (guide) and an information model for the bidirectional exchange of electronic design data and information between customers and foundries. The goal of this ARPA funded effort is to reduce the barriers in exchanging design and component data/information between customers and foundries, thus minimizing cost and maximizing efficiency in the design-to-manufacture of ASEMs

Keywords

CAD/CAM; application specific integrated circuits; circuit CAD; electronic data interchange; hybrid integrated circuits; multichip modules; ASEM customers; ASEM merchant foundries; ASEM suppliers; CAD/CAE/CAM interface specification alliance; EDA vendors; MCMs; application specific electronic modules; cost minimization; design-to-manufacture; efficiency maximization; electronic design data exchange; industry alliance; information exchange; information model; Application software; Assembly; CADCAM; Computer aided engineering; Computer aided manufacturing; Design automation; Documentation; Electronic design automation and methodology; Foundries; Pulp manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-5560-7

Type

conf

DOI

10.1109/MCMC.1994.292528

Filename

292528