DocumentCode
1875310
Title
High performance MCM-D technology
Author
Kikuchi, Shunichi ; Yamamoto, Hiroshi ; Seyama, K. ; Hirano, Minoru ; Moriizumi, K.
Author_Institution
Fujitsu Labs. Ltd., Kawasaki, Japan
fYear
1994
fDate
15-17 Mar 1994
Firstpage
9
Lastpage
14
Abstract
FUJITSU has developed an MCM-D technology which uses bare chips on composite thin films for mounting CMOS chips with high density and low cost. The first use of this technology is for the K6000 Series business server. This MCM technology can be applied to a wide range of computers, from workstations to mainframes to reduce costs and improve performance. This paper focuses on the MCM packaging technology, MCM substrate technology, cooling technology and numerical analysis technique
Keywords
cooling; integrated circuit technology; microassembling; multichip modules; numerical analysis; substrates; CMOS chip mounting; FUJITSU; MCM-D technology; bare chips; composite thin films; cooling technology; high performance MCM technology; numerical analysis technique; packaging technology; substrate technology; CMOS technology; Cooling; Copper; Costs; Packaging; Pins; Polyimides; Substrates; Transistors; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-5560-7
Type
conf
DOI
10.1109/MCMC.1994.292534
Filename
292534
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