Abstract :
Summary form only given, as follows. IBM Federal Systems Company, as a prime contractor, has been awarded a $9.5 Million contract by the Advanced Research Projects Agency (ARPA), entitled “Low Volume Access to High Volume Production”. The objectives of the contract are the development of a design system that allows customers to enter their design into the IBM Technology Products´ Foundry in Hopewell Junction, New York, at various design stages, hybrid chip interconnection technology on a single substrate, participation in the development of industry standards for both known-good-die and the CAD Framework Initiative, and to fabricate, assemble and test multichip modules (MCMs) for use in commercial and military products. The final objective of this contract is to show an order of magnitude reduction in netlist to prototype turn-around-time and non-recurring engineering costs which are consistent with the ARPA ASEM Project goals
Keywords :
contracts; hybrid integrated circuits; integrated circuit manufacture; integrated circuit testing; microassembling; multichip modules; standards; ARPA contract; Advanced Research Projects Agency; CAD Framework Initiative; IBM ARPA ASEM foundry; IBM Federal Systems Company; MCM assemble; MCM testing; design system; hybrid chip interconnection technology; industry standards; known-good-die strategy; multichip modules; Assembly systems; Contracts; Defense industry; Design automation; Foundries; Hybrid junctions; Military standards; Standards development; System testing; Textile industry;
Conference_Titel :
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
