Title :
Electronic-photonic integration in the helios project
Author :
Fedeli, J.M. ; Schrank, Franz ; Bogaerts, W. ; Masood, A. ; Zimmermann, L. ; Augendre, E. ; Bernabe, S. ; Kraft, J. ; Van Olmen, J. ; Sabuncuoglu Tezcan, D. ; Grosse, P. ; Enot, T.
Author_Institution :
LETI, CEA, Grenoble, France
Abstract :
Different ways of integrating of integrating photonics and electronics at the wafer level scale are reviewed: Monolithic, Back-Side, and Front-Side integration. Type and volume applications are selection criteria.
Keywords :
BiCMOS integrated circuits; integrated optoelectronics; wafer-scale integration; Helios project; backside integration; electronic-photonic integration; monolithic integration; wafer level scale; Arrayed waveguide gratings; BiCMOS integrated circuits; Bonding; CMOS integrated circuits; Photonics; Silicon; Through-silicon vias;
Conference_Titel :
Group IV Photonics (GFP), 2013 IEEE 10th International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4673-5803-3
DOI :
10.1109/Group4.2013.6644413
