• DocumentCode
    1875392
  • Title

    Electronic-photonic integration in the helios project

  • Author

    Fedeli, J.M. ; Schrank, Franz ; Bogaerts, W. ; Masood, A. ; Zimmermann, L. ; Augendre, E. ; Bernabe, S. ; Kraft, J. ; Van Olmen, J. ; Sabuncuoglu Tezcan, D. ; Grosse, P. ; Enot, T.

  • Author_Institution
    LETI, CEA, Grenoble, France
  • fYear
    2013
  • fDate
    28-30 Aug. 2013
  • Firstpage
    146
  • Lastpage
    147
  • Abstract
    Different ways of integrating of integrating photonics and electronics at the wafer level scale are reviewed: Monolithic, Back-Side, and Front-Side integration. Type and volume applications are selection criteria.
  • Keywords
    BiCMOS integrated circuits; integrated optoelectronics; wafer-scale integration; Helios project; backside integration; electronic-photonic integration; monolithic integration; wafer level scale; Arrayed waveguide gratings; BiCMOS integrated circuits; Bonding; CMOS integrated circuits; Photonics; Silicon; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2013 IEEE 10th International Conference on
  • Conference_Location
    Seoul
  • ISSN
    1949-2081
  • Print_ISBN
    978-1-4673-5803-3
  • Type

    conf

  • DOI
    10.1109/Group4.2013.6644413
  • Filename
    6644413
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1875392