DocumentCode :
1875423
Title :
A wavelength selectable hybrid III–V/Si laser fabricated by wafer bonding
Author :
Le Liepvre, A. ; Jany, C. ; Accard, A. ; Lamponi, Marco ; Make, Dalila ; Lelarge, F. ; Fedeli, J.-M. ; Messaoudene, S. ; Bordel, D. ; Duan, Guang-Hua
Author_Institution :
III-V Lab., Alcatel-Lucent Bell Labs. France´, Palaiseau, France
fYear :
2013
fDate :
28-30 Aug. 2013
Firstpage :
150
Lastpage :
151
Abstract :
This paper reports on a hybrid III-V on silicon arrayed waveguide grating laser, operating on 5 wavelength channels spaced by 392 GHz, with a threshold current around 40mA and a maximum output power around 3 dBm.
Keywords :
III-V semiconductors; arrayed waveguide gratings; elemental semiconductors; integrated optics; integrated optoelectronics; optical fabrication; semiconductor lasers; silicon; wafer bonding; Si; arrayed waveguide grating laser; bandwidth 392 GHz; output power; threshold current; wafer bonding; wavelength selectable hybrid III-V-Si laser; Arrayed waveguide gratings; Fiber lasers; Laser modes; Optical fibers; Silicon; Waveguide lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Group IV Photonics (GFP), 2013 IEEE 10th International Conference on
Conference_Location :
Seoul
ISSN :
1949-2081
Print_ISBN :
978-1-4673-5803-3
Type :
conf
DOI :
10.1109/Group4.2013.6644415
Filename :
6644415
Link To Document :
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