Title :
Improved fabrication process for III–V based optical interconnects on Silicon
Author :
Spuesens, Thijs ; Regreny, P. ; Van Thourhout, Dries
Author_Institution :
INTEC Dept., Photonics Res. Group, Ghent Univ. - Imec, Ghent, Belgium
Abstract :
We present a controllable bonding method and a self-aligned process for III-V based optical interconnects on Silicon. Optical interconnects are demonstrated with microdisk lasers with either ultra-low threshold current or record high slope efficiency.
Keywords :
III-V semiconductors; elemental semiconductors; integrated optoelectronics; microdisc lasers; optical fabrication; optical interconnections; silicon; III-V based optical interconnects; Si; controllable bonding method; high slope efficiency; microdisk lasers; self-aligned process; ultralow threshold current; Bonding; Detectors; Lasers; Optical interconnections; Optical waveguides; Silicon; Waveguide lasers; heterogeneous integration; microdisk laser; optical interconnect; silicon-on-insulator;
Conference_Titel :
Group IV Photonics (GFP), 2013 IEEE 10th International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4673-5803-3
DOI :
10.1109/Group4.2013.6644417
