• DocumentCode
    187553
  • Title

    Breakdown mechanisms in MgO based magnetic tunnel junctions and correlation with low frequency noise

  • Author

    Amara-Dababi, S. ; Sousa, Ricardo C. ; Bea, H. ; Baraduc, C. ; Mackay, Ken ; Dieny, Bernard

  • Author_Institution
    INAC-CEA, Univ. Grenoble Alpes, Grenoble, France
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Abstract
    Magnetic tunnel junctions (MTJs) are very attractive for magnetic random access memories (MRAMs), thanks to their combination of non-volatility, speed, low power and endurance. In particular spin transfer torque (STT) RAMs based on STT writing show a very good downsize scalability. However, an issue is that at each write event, the MTJ is submitted to an important electrical stress due to write voltage of the order of half of the electrical breakdown voltage. Here we present a study of breakdown mechanisms in MgO based MTJ performed under pulsed conditions. We developed a model of charge trapping/detrapping on barrier defects to explain and predict device endurance. We also show that endurance is correlated to low frequency 1/f noise and that such noise measurement could thus be used as a non destructive and predictive tool for the reliability of the devices.
  • Keywords
    1/f noise; MRAM devices; integrated circuit reliability; magnesium compounds; magnetic tunnelling; semiconductor device breakdown; MRAM; MTJ; MgO; STT writing; barrier defects; charge detrapping; charge trapping; device endurance; device reliability; downsize scalability; electrical breakdown voltage; electrical stress; low frequency 1-f noise; magnetic random access memories; magnetic tunnel junctions; noise measurement; pulsed conditions; spin transfer torque; write voltage; Electric breakdown; Electron traps; Junctions; Magnetic tunneling; Modulation; Noise; Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2014 IEEE International
  • Conference_Location
    Waikoloa, HI
  • Type

    conf

  • DOI
    10.1109/IRPS.2014.6861097
  • Filename
    6861097