Title :
Soft error rates in solder bumped packaging
Author :
Roberson, Mark W.
Author_Institution :
MCNC, Research Triangle Park, NC, USA
Abstract :
Many of the heavier elements used in chip packaging undergo radioactive decay and emit energetic alpha particles. Although the rate of emission is extremely low in terms of health concerns, over the operational life of a circuit the probability of a radiation-induced soft error can be substantial. In this paper I review the physical basis of alpha particle emission and present measurements of the alpha particle emission from materials used in MCNC´s solder bumping process, including PbSn solder and BCB
Keywords :
alpha-particle effects; integrated circuit packaging; integrated memory circuits; large scale integration; radiation hardening (electronics); soldering; BCB; LSI memory; PbSn solder; alpha particle emission; charge production; chip packaging; cosmic ray background; failure rates; metallization layers; radiation-induced soft error; soft error rates; solder bumped packaging; trace radioactive contaminants; Alpha particles; Circuits; Error analysis; Lead; Packaging; Particle measurements; Production; Quantum mechanics; Radioactive decay; Radioactive materials;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664444
