On the prediction of optimal baking schedules in plastic SMD microelectronic devices

Author

Kheng Chooi Lee ; Alpern, Peter

Author_Institution

Centre of Competence for Reliability, Infineon Technol. Asia Pacific Pte Ltd., Singapore, Singapore

fYear

2014

fDate

1-5 June 2014

Abstract

Moisture concentration at the critical material interface is the key parameter as far as moisture sensitivity of a plastic package is concerned. Using a simple 1-D moisture diffusion model, this parameter allowed us to predict the optimal baking time at 125°C for P-DSO14 and MQFP80: 4-16 and 6-24, hours, respectively, depending on the considered material interface. The theoretical predictions agree well with the experimental results. On the other hand, the standard IPC/JEDED J-STD-033C recommends a distinctly longer baking time of 43 hours.

Keywords

integrated circuits; plastic packaging; printed circuit manufacture; process heating; IPC/JEDED J-STD-033C; MQFP80; P-DSO14; baking schedules; material interface; moisture concentration; moisture diffusion model; moisture sensitivity; plastic SMD microelectronic devices; plastic package; temperature 125 degC; time 4 hour to 16 hour; time 43 hour; time 6 hour to 24 hour; Compounds; Moisture; Plastics; Predictive models; Sensitivity; Standards; moisture concentration; moisture diffusion; moisture sensitivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 2014 IEEE International

Conference_Location

Waikoloa, HI

Type

conf

DOI

10.1109/IRPS.2014.6861131

Filename

6861131