DocumentCode
187627
Title
Evaluation of geometry layout and metal pattern to optimize ESD performance of silicon controlled rectifier (SCR)
Author
Zhixin Wang ; Liou, Juin J.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
fYear
2014
fDate
1-5 June 2014
Abstract
We investigate the geometry layout and metal pattern in order to seek robust and optimized electrostatic discharge (ESD) performance for the silicon controlled rectifier (SCR). Parallel and crossing topologies, and different emitter lengths of the parasitic bipolar transistors, finger widths, and finger numbers are shown to significantly affect not only the ESD robustness but also the holding voltage of SCR. This paper provides useful guidelines to ameliorate the SCR performance for ESD protection applications.
Keywords
bipolar transistors; electrostatic discharge; thyristors; ESD performance optimization; ESD protection; SCR; crossing topology; emitter lengths; finger numbers; finger widths; geometry layout evaluation; metal pattern; optimized electrostatic discharge performance; parallel topology; parasitic bipolar transistors; silicon controlled rectifier; Current density; Electrostatic discharges; Fingers; Metals; Robustness; Thyristors; Topology; ESD; SCR; geometry; metal; pattern; robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2014 IEEE International
Conference_Location
Waikoloa, HI
Type
conf
DOI
10.1109/IRPS.2014.6861133
Filename
6861133
Link To Document