• DocumentCode
    1876307
  • Title

    Reverse conduction of a 100 A SiC DMOSFET module in high-power applications

  • Author

    Wood, R.A. ; Urciuoli, D.P. ; Salem, T.E. ; Green, R.

  • Author_Institution
    U. S. Army Res. Lab., Adelphi, MD, USA
  • fYear
    2010
  • fDate
    21-25 Feb. 2010
  • Firstpage
    1568
  • Lastpage
    1571
  • Abstract
    Numerous research efforts over the past few years have documented the enhanced capabilities that Silicon Carbide (SiC) offers over Silicon based power electronic devices. Additional research work has led to vast improvements in the manufacturing of SiC based components. As a result, SiC power electronic components, primarily diodes, are now readily available and this technology promises to have widespread market impact as more complex device structures are commercially realized. Recently, the development of a 1200 V 50 A SiC DMOSFET device and its use in a 100 A power module has been documented. This paper extends that research work to report on the reverse conduction characteristics of the SiC DMOSFET and the system-level benefits for high-power applications that can be achieved by operating these devices in this manner. Experimental data is presented on the 100 A module consisting of two, 50 A SiC DMOSFETs and two, 50 A SiC JBS anti-parallel free-wheeling diodes used in a high-power bi-directional DC-DC converter during buck mode operation.
  • Keywords
    DC-DC power convertors; MOSFET; modules; power transistors; silicon compounds; wide band gap semiconductors; DMOSFET module; SiC; antiparallel free-wheeling diodes; bidirectional DC-DC converter; buck mode operation; current 100 A; current 50 A; power electronic components; power module; reverse conduction; silicon carbide; voltage 1200 V; Bidirectional control; DC-DC power converters; Light emitting diodes; Milling machines; Multichip modules; Powders; Power electronics; Silicon carbide; Switching converters; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2010 Twenty-Fifth Annual IEEE
  • Conference_Location
    Palm Springs, CA
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4244-4782-4
  • Electronic_ISBN
    1048-2334
  • Type

    conf

  • DOI
    10.1109/APEC.2010.5433440
  • Filename
    5433440