Title :
Component and system effective lifetime & FIT model in advanced technology
Author :
Lee, J. K. Jerry ; Haggag, A.
Author_Institution :
Cisco Syst., Inc., San Jose, CA, USA
Abstract :
A model is derived to calculate component effective lifetime and failure rate (FIT) for arbitrary use conditions (temperature and voltage). The overall component failure rate vs time for HKMG technology node is demonstrated to be Weibull dominated by BTI combined extrinsic failures although wearout failure modes begin to encroach on the overall failure rate.
Keywords :
Weibull distribution; failure analysis; high-k dielectric thin films; integrated circuit modelling; integrated circuit reliability; BTI combined extrinsic failures; FIT model; HKMG technology node; IC component; Weibull failure distribution; component effective lifetime; component failure rate; system effective lifetime; wearout failure modes; Equations; Error correction codes; Failure analysis; Human computer interaction; Logic gates; Mathematical model; Temperature dependence;
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
DOI :
10.1109/IRPS.2014.6861138
