DocumentCode
187645
Title
Time resolved emission observation from top surface in avalanche breakdown of power MOSFET
Author
Endo, Kazuhiro ; Norimatsu, K. ; Nakashima, Kazuto ; Setoya, T. ; Nagamine, S. ; Nakamura, T. ; Koshikawa, K. ; Nakamae, Koji
Author_Institution
Semicond. & Storage Products Co., Toshiba Corp., Himeji, Japan
fYear
2014
fDate
1-5 June 2014
Abstract
Time resolved emission (TRE) microscopy can detect photons, and its signal-to-noise (S/N) ratio is higher than that of Photo Emission Microscopy under weak emission conditions. This is the first study to show the TRE observation in avalanche breakdown through thick source metal from the top surface of power MOSFET. TRE is an effective method to detect several photons, however, the strong emission range saturate the output of TRE detectors and this phenomenon disturbs accurate photon measurement. Our study results show that the photon count behavior is consistent with the oscillation of avalanche current. Also, the distribution of photon count density in the regions of the device is different, which indicates that there is distribution of current density in MOSFET. The described approach has the capacity to observe the current density distribution without any power device electrode metal removal and can be applied to measure the oscillation behavior of avalanche current.
Keywords
avalanche breakdown; current density; electric current measurement; electrodes; microscopy; photon counting; power MOSFET; time resolved spectra; TRE detectors; TRE microscopy; avalanche breakdown; avalanche current; current density distribution; oscillation behavior; photo emission microscopy; photon count behavior; photon count density; photon measurement; power MOSFET; power device electrode metal removal; signal-to-noise ratio; thick source metal; time resolved emission observation; weak emission conditions; Avalanche breakdown; Current measurement; Logic gates; MOSFET; Metals; Photonics; Semiconductor device measurement; MOSFET; Power Device; Time Resolved Emission (TRE); Unclamped Inductive Switching (UIS); avalanche breakdown;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2014 IEEE International
Conference_Location
Waikoloa, HI
Type
conf
DOI
10.1109/IRPS.2014.6861142
Filename
6861142
Link To Document