• DocumentCode
    1876485
  • Title

    Biotemplated hierarchical nickel oxide supercapacitor electrodes

  • Author

    Sangwook Chu ; Gerasopoulos, Konstantinos ; Ghodssi, Reza

  • Author_Institution
    MEMS Sensors & Actuators Lab. (MSAL), Univ. of Maryland, College Park, MD, USA
  • fYear
    2015
  • fDate
    18-22 Jan. 2015
  • Firstpage
    1118
  • Lastpage
    1121
  • Abstract
    This paper presents fabrication and characterization of Tobacco mosaic virus (TMV)-templated hierarchical nickel oxide (NiO) supercapacitor electrodes. The hierarchical NiO electrode was created by integrating silicon (Si) micropillars with thermally oxidized nickel (Ni)-coated TMVs. SEM images taken after the high temperature oxidation process verified the robustness of the bio-nanotemplates, while the formation of Ni(core)/NiO(shell) structure around the rod-like virus was confirmed by scanning transmission electron microscopy (STEM). Electrochemical characterization showed that the capacitance for TMV structured Ni/NiO electrodes continuously increases for the first 500 cycles, with significantly higher, non-linear increase for the hierarchical versus TMV-only (nanostructured) electrodes. Further electrochemical and SEM analysis support the hypothesis that the capacity increase is due to the increase in electroactive sites of the nanostructured NiO throughout the initial charge/discharge cycles.
  • Keywords
    electrochemical electrodes; nickel compounds; oxidation; scanning electron microscopy; supercapacitors; tobacco products; transmission electron microscopy; NiO; SEM image; STEM; Si; bionanotemplates; biotemplated hierarchical nickel oxide supercapacitor electrodes; electrochemical characterization; high temperature oxidation process; rod-like virus; scanning transmission electron microscopy; tobacco mosaic virus; Capacitance; Discharges (electric); Electrodes; Nickel; Silicon; Supercapacitors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
  • Conference_Location
    Estoril
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2015.7051160
  • Filename
    7051160