Title :
Effect of via arrangement on electromigration performance
Author :
Zhang, Zhenhao ; Basavalingappa, A. ; Lloyd, J.R. ; Tan, Jason ; Justison, P.
Author_Institution :
SUNY Coll. of Nanoscale Sci. & Eng. (CNSE), Albany, NY, USA
Abstract :
Despite the theory of electromigration is well understood, it is still none trivial to meet all the qualification requirements as technology scales. This paper addresses the impacts of via configuration on electromigration from both physical and statistical point of view.
Keywords :
electromigration; vias; electromigration performance; via arrangement effect; Copper; Electromigration; Extrapolation; Reliability; Resistance; Stress; Testing; Electromigration (EM); Failure Criteria; Via Redundancy;
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
DOI :
10.1109/IRPS.2014.6861155
