• DocumentCode
    187669
  • Title

    Effect of via arrangement on electromigration performance

  • Author

    Zhang, Zhenhao ; Basavalingappa, A. ; Lloyd, J.R. ; Tan, Jason ; Justison, P.

  • Author_Institution
    SUNY Coll. of Nanoscale Sci. & Eng. (CNSE), Albany, NY, USA
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Abstract
    Despite the theory of electromigration is well understood, it is still none trivial to meet all the qualification requirements as technology scales. This paper addresses the impacts of via configuration on electromigration from both physical and statistical point of view.
  • Keywords
    electromigration; vias; electromigration performance; via arrangement effect; Copper; Electromigration; Extrapolation; Reliability; Resistance; Stress; Testing; Electromigration (EM); Failure Criteria; Via Redundancy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2014 IEEE International
  • Conference_Location
    Waikoloa, HI
  • Type

    conf

  • DOI
    10.1109/IRPS.2014.6861155
  • Filename
    6861155
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=187669