Title :
Setting use conditions for reliability modeling
Author :
Kwasnick, Robert ; Polasam, Praveen ; Lucero, Adrian
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Abstract :
Use conditions (UCs) are necessary inputs for knowledge-based qualification reliability modeling calculations, and are implied by standard-based qualification stress conditions. We describe a method for setting CPU UCs. A sampled distribution of field data is analyzed, accounting for the reliability model Weibull shape factor. That is combined with other information to determine a reference value for modeling, with appropriate conservatism. We present application to notebook PCs for both silicon and thermo-mechanical CPU wearout mechanisms.
Keywords :
Weibull distribution; failure analysis; knowledge based systems; microcomputers; notebook computers; qualifications; reliability; stress analysis; thermomechanical treatment; CPU UC; Weibull shape factor; central processor units; field data; knowledge-based qualification reliability modeling calculations; notebook PC; silicon; standard-based qualification stress conditions; thermomechanical CPU wearout mechanisms; use conditions; Computer architecture; Failure analysis; Integrated circuit modeling; Knowledge based systems; Measurement; Qualifications; Reliability; knowledge based qualification; product qualification; reliability modeling; use conditions;
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
DOI :
10.1109/IRPS.2014.6861172