• DocumentCode
    1877086
  • Title

    Detachable Silicon Microneedle Stamps for Allergy Skin Prick Testing

  • Author

    Trautmann, A. ; Heuck, F. ; Denfeld, R. ; Ruther, P. ; Paul, O.

  • Author_Institution
    Microsystems Materials Laboratory (MML), Department of Microsystems Engineering (IMTEK), University of Freiburg, Georges-Koehler-Allee 103, D-79110 Freiburg, Germany
  • fYear
    2006
  • fDate
    2006
  • Firstpage
    434
  • Lastpage
    437
  • Abstract
    We report on the fabrication and application of novel silicon microneedle chips for allergy skin prick testing. Due to the mask layout the needle chips can be directly detached from the wafer after their double-sided fabrication process. Silicon wafers with a total of 117 chips implementing various designs are fabricated. The chip center features a hole with a diameter of 0.5 mm into which a 25-gauge hypodermic needle can be easily inserted to directly detach the chips from the wafer without dicing. This enables the disposable microneedle chips to be handled without harming the needle structures. Skin prick tests performed with the microneedle stamps showed excellent results in comparison with common lancet pricking.
  • Keywords
    Annealing; Dry etching; Fabrication; Lithography; Needles; Residual stresses; Silicon; Skin; Tensile stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on
  • Conference_Location
    Istanbul, Turkey
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-9475-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2006.1627829
  • Filename
    1627829