Title :
Similarity and difference in temperature dependent recovery of HCS and NBTI
Author_Institution :
Image Recognition & Inspection Syst. Dept., Hitachi Ltd., Yokohama, Japan
Abstract :
We investigated the temperature dependence of recovery behavior in p-channel MOSFETs after subjected to hot carrier stress (HCS) and negative bias temperature stress (NBTS) from the recovery activation energy distributions of threshold voltage shifts (ErV) and of interface states (ErD). Both ErV and ErD are composed of the two elements, so-called recoverable- and permanent components (R and P). We found that the temperature dependent recovery after HCS and NBTS can be interpreted by R and P. In addition, the degradation mechanism, i.e., origins of R and P, was discussed. This study sheds light on the high temperature degradation mechanism.
Keywords :
MOSFET; hot carriers; negative bias temperature instability; stress analysis; HCS; NBTI; high temperature degradation mechanism; hot carrier stress; interface state; negative bias temperature stress; p-channel MOSFET; permanent component; recoverable-component; recovery activation energy distribution; temperature dependent recovery; threshold voltage shift; Degradation; Erbium; MOSFET; Reliability; Stress; Temperature dependence; Temperature measurement; HCS; NBTI; energy distribution; recovery;
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
DOI :
10.1109/IRPS.2014.6861179