Title :
Characterization and processing of low dielectric constant thick film substrates for electronic packaging applications
Author :
Kellerman, Dave ; Retherford, Larry ; Nabatian, David J. ; Bokalo, Peter ; He, Feng ; Barlow, Fred ; Elshabini, Aicha
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
Abstract :
The application of the new microsphere Low K thick film material to large MCM-C substrates is discussed in this paper. Processing of large ceramic boards approximately 6.5×8.5 inches square with 4 metal layers is described. Both screen printed and etched silver and gold metallizations are used for this work. Electrical, physical, and materials characterization of both silver and gold compatible multilayer Low K dielectric material is detailed. High frequency characterization of the material is also discussed, over a wideband frequency bandwidth between 1-12 GHz
Keywords :
integrated circuit interconnections; integrated circuit packaging; multichip modules; permittivity; substrates; thick films; 6.5 inch; 8.5 inch; Ag; Au; assembly process compatibility; electrical characterization; electronic packaging applications; etched metallizations; high frequency characterization; large MCM-C substrates; large ceramic boards; low dielectric constant thick film substrates; materials characterization; microsphere low K thick film material; multilayer interconnect; physical characterization; screen printed metallizations; wideband frequency bandwidth; Ceramics; Dielectric constant; Dielectric materials; Dielectric substrates; Etching; Frequency; Gold; Metallization; Silver; Thick films;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664448
